Electromagnetic coupling effects in RFCMOS circuits

Author

Adan, A.O. ; Fukumi, M. ; Higashi, K. ; Suyama, T. ; Miyamoto, M. ; Hayashi, M.

Author_Institution

IC Dev. Group, Sharp Corp., Nara, Japan

Volume

1

fYear

2002

fDate

2-7 June 2002

Firstpage

39

Abstract

The electromagnetic isolation and coupling characteristics of basic structures, namely metal pads, spiral inductors, and spiral-transistors, implemented in a core-logic CMOS process are evaluated and modeled. The models provide design guidelines on the isolation characteristics of guard-rings and shield layers for RF cross-talk suppression between circuit blocks. The importance of electromagnetic coupling to layout interconnects is demonstrated.

Keywords

CMOS integrated circuits; UHF integrated circuits; capacitance; electromagnetic compatibility; electromagnetic coupling; equivalent circuits; inductors; integrated circuit layout; isolation technology; CMOS RFICs; EM coupling effects; EMC effects; RF crosstalk suppression; RFCMOS circuits; core-logic CMOS process; design guidelines; electromagnetic coupling characteristics; electromagnetic isolation characteristics; guard-rings; layout interconnects; metal pads; shield layers; spiral inductors; spiral-transistors; CMOS process; Coupling circuits; Electromagnetic coupling; Electromagnetic induction; Electromagnetic modeling; Electromagnetic shielding; Guidelines; Inductors; Semiconductor device modeling; Spirals;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2002 IEEE MTT-S International

Conference_Location

Seattle, WA, USA

ISSN

0149-645X

Print_ISBN

0-7803-7239-5

Type

conf

DOI

10.1109/MWSYM.2002.1011553

Filename

1011553