• DocumentCode
    1830363
  • Title

    Multistage process monitoring using survival analysis regression models

  • Author

    Asadzadeh, S. ; Aghaie, A. ; Samimi, Y.

  • Author_Institution
    Dept. of Ind. Eng., K. N. Toosi Univ. of Technol., Tehran, Iran
  • fYear
    2010
  • fDate
    7-10 Dec. 2010
  • Firstpage
    2158
  • Lastpage
    2162
  • Abstract
    In this paper, we consider the monitoring of a multistage process in which the outgoing quality attribute is a reliability-related characteristic. To measure the tensile strength of such quality characteristics, the process output is commonly inspected under limited load conditions. As a result, we may encounter censored observations which demand a certain monitoring procedure. The monitoring scheme becomes more complicated when the censoring occurs due to variable competing risks as well. To address this critical issue, we propose a regression-adjusted CUSUM chart to effectively monitor a quality characteristic that may be right censored because of both fixed and variable competing risks. The result of a simulation study confirms the superiority of the proposed method in comparison with the existing one. The proposed control chart is applicable not only to reliability measures in manufacturing processes but also to similar quality indices in service operations such as survivability measures in healthcare services.
  • Keywords
    process monitoring; quality control; regression analysis; reliability; tensile strength; CUSUM chart; multistage process monitoring; quality attribute; reliability-related characteristic; service operations; survival analysis regression models; tensile strength; Control charts; Data models; Monitoring; Process control; Reliability; Semiconductor process modeling; Accelerated failure time (AFT) model; CUSUM control chart; Competing risk; Multistage process;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Engineering and Engineering Management (IEEM), 2010 IEEE International Conference on
  • Conference_Location
    Macao
  • ISSN
    2157-3611
  • Print_ISBN
    978-1-4244-8501-7
  • Electronic_ISBN
    2157-3611
  • Type

    conf

  • DOI
    10.1109/IEEM.2010.5674554
  • Filename
    5674554