Suppression of the parallel-plate noise in high-speed circuits using a metallic electromagnetic band-gap structure

Author

Abhari, R. ; Eleftheriades, G.V.

Author_Institution

Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada

Volume

1

fYear

2002

fDate

2-7 June 2002

Firstpage

493

Abstract

A novel approach for the suppression of the parallel-plate noise in high-speed circuits is proposed by utilizing a metallic electromagnetic band-gap (EBG) structure. The key idea relies on replacing one of the two solid electric conductor plates with a metallic EBG surface of compact texture. To validate the concept, an EBG surface was fabricated and employed in a number of via-containing parallel-plate test boards. Frequency domain measurements showed a band-gap of about 1.7 GHz around 3.77 GHz. More importantly, suppression of the parallel-plate noise by 65% was achieved based on time domain reflectometry experiments.

Keywords

frequency-domain analysis; high-speed integrated circuits; integrated circuit design; integrated circuit interconnections; integrated circuit noise; interference suppression; radiofrequency interference; time-domain reflectometry; 3.77 GHz; RF noise currents; compact texture metallic EBG surface; frequency domain measurements; high-speed circuits; metallic electromagnetic band-gap structure; parallel-plate noise suppression; physics-based CAD model; solid electric conductor plates; time domain reflectometry; via-containing parallel-plate test boards; vias; Circuit noise; Circuit testing; Conductors; Electromagnetic interference; Frequency domain analysis; Frequency measurement; Metamaterials; Periodic structures; Solids; Surface texture;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2002 IEEE MTT-S International

Conference_Location

Seattle, WA, USA

ISSN

0149-645X

Print_ISBN

0-7803-7239-5

Type

conf

DOI

10.1109/MWSYM.2002.1011664

Filename

1011664