DocumentCode
1831734
Title
Integrated magnetic-semiconductor components
Author
Lotfi, Ashraf ; Weld, John
Author_Institution
AT&T Bell Labs., Murray Hill, NJ, USA
fYear
1998
fDate
17-19 Sep 1998
Firstpage
39
Lastpage
43
Abstract
We have taken a component view of packaging techniques to achieve high density, low profile power converters. In this work, we have focused on the simultaneous z-axis mounting and plastic encapsulation of the power magnetic device and the power semiconductors into one integrated package. In this effort we study the impact on power density, electrical and thermal performance as well as manufacturability
Keywords
encapsulation; plastic packaging; power convertors; power semiconductor devices; thermal analysis; electrical performance; low profile power converters; manufacturability; packaging techniques; plastic encapsulation; power density; power magnetic device; power semiconductors; thermal performance; z-axis mounting; Chip scale packaging; Copper; Encapsulation; Lead; Magnetic devices; Pins; Plastic packaging; Semiconductor device manufacture; Semiconductor device packaging; Windings;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Power Packaging, 1998. IWIPP. Proceedings., IEEE International Workshop on
Conference_Location
Chicago, IL
Print_ISBN
0-7803-5033-2
Type
conf
DOI
10.1109/IWIPP.1998.722249
Filename
722249
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