• DocumentCode
    1832694
  • Title

    Electrothermal nonlinear FET modeling for spectral prediction

  • Author

    Baylis, Charles ; Dunleavy, Larry

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Baylor Univ., Waco, TX, USA
  • fYear
    2009
  • fDate
    17-21 Aug. 2009
  • Firstpage
    95
  • Lastpage
    98
  • Abstract
    The origin, mechanisms, and modeling of nonlinearities responsible for spectral spreading are reviewed and discussed. Intermodulation distortion, responsible for spectral spreading, is affected by slow memory effects. Pulsed IV measurements are used to obtain model current equations that have appropriate steady-state quiescent bias dependences related to channel temperature and trap occupancy. Thermal resistance can be measured in silicon devices by using ambient temperature adjustments to measure channel temperature changes due to quiescent self-heating. The presence of trap states in GaN HEMTs makes the assessment of thermal resistance much more difficult; however, the presence of these effects can be determined by comparing two sets of IV curves taken from quiescent bias points of equal power dissipation. Results are presented showing accurate prediction of third-, fifth-, and seventh-order intermodulation projects using an electrothermal model for a power Si MOSFET.
  • Keywords
    gallium compounds; high electron mobility transistors; intermodulation distortion; power MOSFET; semiconductor device measurement; semiconductor device models; thermal resistance; GaN; GaN HEMT; Si; electrothermal model; intermodulation distortion; power Si MOSFET; power dissipation; quiescent self-heating; slow memory effects; spectral spreading; thermal resistance; trap states; Current measurement; Distortion measurement; Electrical resistance measurement; Electrothermal effects; FETs; Intermodulation distortion; Predictive models; Pulse measurements; Temperature measurement; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2009. EMC 2009. IEEE International Symposium on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-4266-9
  • Electronic_ISBN
    978-1-4244-4058-0
  • Type

    conf

  • DOI
    10.1109/ISEMC.2009.5284588
  • Filename
    5284588