• DocumentCode
    1833619
  • Title

    A two-electrode 2.88nJ/conversion biopotential acquisition system for portable healthcare device

  • Author

    Yan, Long ; Cho, Namjun ; Yoo, Jerald ; Kim, Binhee ; Yoo, Hoi-Jun

  • Author_Institution
    Dept. of EECS, Korea Adv. Inst. of Sci. & Technol. (KAIST), Daejeon
  • fYear
    2008
  • fDate
    3-5 Nov. 2008
  • Firstpage
    329
  • Lastpage
    332
  • Abstract
    A 2.88 nJ/Conversion low energy biopotential acquisition system is designed for portable healthcare device. Two dry copper contact electrodes with 1.2-cm diameter are used to easily interface between skin and healthcare device. Chopping technique is adopted at readout front end to obtain thermal noise floor of 1.3 uVrms over 0.5~200 Hz and CMRR over 100 dB to mitigate common-mode body potential induced from AC power line. A 4-stage gain control and band selection blocks are integrated to digitally calibrate for different types of biomedical signal and an 8-bit synchronous successive approximation register (SAR) A/D is used to digitize sensed biopotentials. A test chip is implemented in 0.18 um, 1.8 V supply CMOS technology and successively verified by readout ECG signal with two electrodes contact at chest of body with separating 6 cm.
  • Keywords
    CMOS digital integrated circuits; bioelectric potentials; biomedical electrodes; copper; electrocardiography; CMOS technology; ECG signal; biomedical signal; copper contact electrodes; digitize sensed biopotentials; electrodes contact; frequency 0.5 Hz to 200 Hz; portable healthcare device; size 0.18 micron; stage gain control; synchronous successive approximation register; test chip; thermal noise floor; two-electrode conversion biopotential acquisition system; voltage 1.8 V; Biomedical electrodes; Biomedical measurements; CMOS technology; Copper; Electrocardiography; Electromagnetic interference; Impedance; Instruments; Medical services; Skin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 2008. A-SSCC '08. IEEE Asian
  • Conference_Location
    Fukuoka
  • Print_ISBN
    978-1-4244-2604-1
  • Electronic_ISBN
    978-1-4244-2605-8
  • Type

    conf

  • DOI
    10.1109/ASSCC.2008.4708794
  • Filename
    4708794