Coupling of large number of vias in electronic packaging structures and differential signaling

Author

Houfei Chen ; Qin Li ; Leung Tsang ; Jandhyala, V.

Author_Institution

Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA

Volume

2

fYear

2002

fDate

2-7 June 2002

Firstpage

983

Abstract

A method is presented for modeling the multi-interaction among large numbers of vertical vias in densely packaged integrated circuits. The analysis of the interior problem is based upon a cylindrical wave expansion of the magnetic field Green´s function and the foldy-lax multiple scattering formula. The exterior problem of bent traces is analyzed using the MOM approach. A system matrix equation is obtained by combining the exterior and interior problem, the solution of which gives the propagation characteristics of the entire structure. Using an iterative solver, results are illustrated for problems of several thousand vias with moderate CPU and memory requirements. Also illustrated are the results for common and differential modes in differential signaling, including the effects of surrounding idle vias and shorting vias.

Keywords

Green´s function methods; conjugate gradient methods; coupled transmission lines; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; method of moments; transmission line matrix methods; MOM approach; bent traces; bi-conjugate gradient method; coupled transmission lines; cylindrical wave expansion; densely packaged integrated circuits; differential signaling; electronic packaging structures; foldy-lax multiple scattering formula; interior problem; iterative solver; magnetic field Green function; propagation characteristics; shorting vias; surrounding idle vias; system matrix equation; vertical via coupling; Circuit analysis; Coupling circuits; Electronics packaging; Green´s function methods; Integrated circuit modeling; Integrated circuit packaging; Magnetic analysis; Magnetic fields; Message-oriented middleware; Scattering;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2002 IEEE MTT-S International

Conference_Location

Seattle, WA, USA

ISSN

0149-645X

Print_ISBN

0-7803-7239-5

Type

conf

DOI

10.1109/MWSYM.2002.1011794

Filename

1011794