• DocumentCode
    1835551
  • Title

    Estimating interconnect performance for a new National Technology Roadmap for Semiconductors

  • Author

    Mangaser, Ramon ; Rose, Kenneth

  • Author_Institution
    Dept. of Electr. Comput. & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY, USA
  • fYear
    1998
  • fDate
    1-3 Jun 1998
  • Firstpage
    253
  • Lastpage
    255
  • Abstract
    The advent of smaller submicron feature sizes for CMOS technology has led to ever increasing device speeds but has singled out interconnects (which do not scale well) as the limiting constraint for microelectronics technology. This has led to extensive research in alternative materials as well as wiring configurations needed for interconnects to catch up with increasing clock speeds. Improvements in interconnect technology alone, i.e. new materials and interconnect configurations, will not provide the high performance anticipated by the 1997 NTRS. Changes in chip architecture and circuits are also required. This is where an early performance estimator is valuable. Large design spaces can be explored without committing to a particular configuration. Using the Rensselaer Interconnect Performance Estimator (RIPE), we show that it is relatively easy to evaluate the performance of proposed designs
  • Keywords
    CMOS integrated circuits; circuit analysis computing; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; integrated circuit modelling; CMOS technology; National Technology Roadmap for Semiconductors; Rensselaer Interconnect Performance Estimator; chip architecture; clock speeds; design performance evaluation; design space; device speed; downscaling limiting constraint; early performance estimator; feature size; interconnect configurations; interconnect materials; interconnect performance estimation; interconnect scaling; interconnect technology; interconnects; microelectronics technology; CMOS technology; Clocks; Frequency estimation; Integrated circuit interconnections; Materials science and technology; Power dissipation; Power system interconnection; Random access memory; Space technology; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Interconnect Technology Conference, 1998. Proceedings of the IEEE 1998 International
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-4285-2
  • Type

    conf

  • DOI
    10.1109/IITC.1998.704914
  • Filename
    704914