DocumentCode
1836346
Title
Power and performance comparison of crossbars and buses as on-chip interconnect structures
Author
Zhang, Yan ; Irwin, M.J.
Author_Institution
Dept. of Comput. Sci. & Eng., Pennsylvania State Univ., University Park, PA, USA
Volume
1
fYear
1999
fDate
24-27 Oct. 1999
Firstpage
378
Abstract
Traditionally, buses have been traditionally used as datapath interconnects because of their simplicity. Yet, as technology quickly scales down and the industry embraces systems-on-a-chip (SoC), the increasing global interconnect delay and chip power consumption become big concerns, and alternative datapath interconnect structures should be considered. This paper evaluates two datapath interconnection alternatives-full connection crossbars and multiple-input/output-port buses-at the transistor level and compares their power and delay performances. The results show that although a full connection crossbar consumes more energy per cycle and incurs larger delays than buses, crossbars consume less energy per data transfer when the number of input/output ports is small and the crossbar operates in full parallelism. This makes crossbars a good choice for connecting components and transferring parallel data in SoC designs.
Keywords
CMOS integrated circuits; MIMO systems; integrated circuit interconnections; system buses; SoC design; datapath interconnects; full connection crossbars; multiple-input/output-port buses; on-chip interconnect structures; parallel data; performance comparison; performances; power consumption; systems-on-a-chip; Aluminum; Capacitance; Copper; Delay; Electric resistance; Energy consumption; Integrated circuit interconnections; Power system interconnection; Voltage; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Signals, Systems, and Computers, 1999. Conference Record of the Thirty-Third Asilomar Conference on
Conference_Location
Pacific Grove, CA, USA
ISSN
1058-6393
Print_ISBN
0-7803-5700-0
Type
conf
DOI
10.1109/ACSSC.1999.832356
Filename
832356
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