• DocumentCode
    1837007
  • Title

    Composite antenna pattern for realistic ray tracing simulations

  • Author

    Stratis, G. ; Corral, C.A. ; Emami, S. ; Sibecas, S. ; Rasor, G. ; Kipp, R.

  • Author_Institution
    Motorola Labs., Boynton Beach, FL, USA
  • Volume
    2
  • fYear
    2003
  • fDate
    22-27 June 2003
  • Firstpage
    106
  • Abstract
    The widespread adoption of wireless local area networks (WLAN) and the emerging wireless personal area networks (WPAN) has required a deeper understanding of the indoor propagation channel. As a consequence, ray analysis techniques based on geometrical optics have emerged as the tools of choice for modeling indoor and outdoor environments. In realistic scenarios, antennas will be installed within proximity to wall structures or embedded in complex environments such as vehicle interiors for telematics applications. Hence. we no longer have free space antenna patterns but composite antenna patterns. We consider here the application of the finite-difference time-domain (FDTD) technique for obtaining 3D antenna patterns in complex structures with different material properties. Simulation results are submitted and discussed.
  • Keywords
    antenna radiation patterns; electromagnetic wave scattering; finite difference time-domain analysis; indoor radio; radiowave propagation; ray tracing; 3D antenna patterns; FDTD; WLAN; WPAN; antenna wall structure proximity; complex structures; composite antenna pattern; embedded antennas; finite-difference time-domain technique; geometrical optics; indoor propagation channel; ray analysis techniques; ray tracing simulation; scattering; vehicle interiors; wireless local area networks; wireless personal area networks; Antennas and propagation; Finite difference methods; Geometrical optics; Optical propagation; Ray tracing; Solid modeling; Time domain analysis; Vehicles; Wireless LAN; Wireless personal area networks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 2003. IEEE
  • Conference_Location
    Columbus, OH, USA
  • Print_ISBN
    0-7803-7846-6
  • Type

    conf

  • DOI
    10.1109/APS.2003.1219190
  • Filename
    1219190