DocumentCode
1838024
Title
Embedded metallic nanoparticles for on-chip infrared detection
Author
Zhu, Shiyang ; Lo, G.Q. ; Kwong, D.L.
Author_Institution
Inst. of Microelectron., A*STAR (Agency for Sci., Technol. & Res.), Singapore, Singapore
fYear
2012
fDate
27-29 Aug. 2012
Firstpage
134
Lastpage
135
Abstract
Conventional silicide Schottky barrier photodetector suffers from low responsivity due to the low emission probability of photoexcited hot carriers from the silicide layer to the Si layer. The photoexcited carriers in metallic nanoparticle may have large emission probability because they meet the metal/Si interface at all directions. Moreover, the light absorption by the metallic nanoparticles may also be dramatically enhanced due to excitation of localized surface plasmon resonance. A proof-of-concept detector based on the embedded Ni silicide nanopaticles are fabricated using standard CMOS technology. It exhibits a peak responsivity of ~30 mA/W and a 3-dB bandwidth of ~6 GHz. The approaches to improve the performance are addressed.
Keywords
CMOS integrated circuits; Schottky barriers; elemental semiconductors; hot carriers; infrared detectors; light absorption; nanoparticles; nanosensors; photodetectors; photoexcitation; probability; silicon; surface plasmon resonance; Schottky barrier photodetector; Si; embedded metallic nanoparticle; gain 3 dB; light absorption; localized surface plasmon resonance excitation; low emission probability; on-chip infrared detection; photoexcited hot carrier; standard CMOS technology; Absorption; Detectors; Nanoparticles; Nickel; Schottky barriers; Silicides; Silicon; Infrared detector; localized surface plasmon resonance; metallic nanoparticles;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation (APCAP), 2012 IEEE Asia-Pacific Conference on
Conference_Location
Singapore
Print_ISBN
978-1-4673-0666-9
Type
conf
DOI
10.1109/APCAP.2012.6333184
Filename
6333184
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