DocumentCode
1838207
Title
Proceedings of the IEEE 2005 International Interconnect Technology Conference (IEEE Cat. No. 05TH8780)
fYear
2005
fDate
6-8 June 2005
Abstract
The following topics are dealt with: IC interconnects; IC packaging; IC metallization; IC reliability; dielectric thin films; SOI; CMP; planarization; nanoelectronics; optical interconnects; chemical cleaning; delamination.
Keywords
chemical mechanical polishing; delamination; dielectric thin films; integrated circuit interconnections; integrated circuit metallisation; integrated circuit packaging; integrated circuit reliability; nanoelectronics; optical interconnections; planarisation; silicon-on-insulator; surface cleaning; CMP; Cu; IC interconnects; IC metallization; IC packaging; IC reliability; SOI; chemical cleaning; delamination; dielectric thin films; nanoelectronics; optical interconnects; planarization;
fLanguage
English
Publisher
ieee
Conference_Titel
Interconnect Technology Conference, 2005. Proceedings of the IEEE 2005 International
Conference_Location
Burlingame, CA, USA
Print_ISBN
0-7803-8752-X
Type
conf
DOI
10.1109/IITC.2005.1499886
Filename
1499886
Link To Document