• DocumentCode
    1838252
  • Title

    High thermal conductivity materials and their application on the electronic products

  • Author

    Zhong, Jiangwei ; Liu, Dingxin ; Li, Zhuo ; Sun, Xiaowei

  • Author_Institution
    Shanghai Inst. of Microsyst. & Inf. Technol., Shanghai, China
  • fYear
    2012
  • fDate
    27-29 Aug. 2012
  • Firstpage
    173
  • Lastpage
    175
  • Abstract
    We can find a variety of high thermal conductivity of polymer materials, polymer, oxide materials, nitrides materials, carbon family material, metal material, iron-based materials, high thermal conductivity graphite and so on, the best choice for material in a variety of electronic products on the chip cooling is high thermal conductivity graphite. In this work, high thermal conductivity graphite film was used for chip cooling in the smart phone, and we found that it can lower their operating temperature. In the case of 4G LTE will be widely used with high speed rate and high bandwidth, the consumer electronics cooling problem is particularly prominent.
  • Keywords
    4G mobile communication; Long Term Evolution; consumer electronics; cooling; electronic products; graphite; smart phones; thermal conductivity; 4G LTE; carbon family material; chip cooling; consumer electronic cooling problem; electronic products; high thermal conductivity graphite film; high thermal conductivity materials; iron-based materials; metal material; nitride materials; oxide materials; polymer materials; smart phone; Conductivity; Polymers; Smart phones; Temperature measurement; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation (APCAP), 2012 IEEE Asia-Pacific Conference on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4673-0666-9
  • Type

    conf

  • DOI
    10.1109/APCAP.2012.6333195
  • Filename
    6333195