DocumentCode
1838427
Title
Proposed strategies for microelectronic packaging education for next generation engineers
Author
Kim, Bruce C.
Author_Institution
Dept. of Electr. Eng., Tufts Univ., Medford, MA, USA
fYear
1998
fDate
25-28 May 1998
Firstpage
547
Lastpage
550
Abstract
Discusses several proposed strategies to integrate microelectronic packaging education in the electrical engineering curriculum at Tufts University. The strategies include some of the traditional initiatives and a novel approach for undergraduates, graduates and professionals in industry
Keywords
educational courses; electronic engineering education; integrated circuit packaging; Tufts University; electrical engineering curriculum; graduates; microelectronic packaging; next generation engineers; packaging education; professionals; undergraduates; Educational programs; Electronic equipment testing; Electronic packaging thermal management; Electronics packaging; Laboratories; Materials processing; Microelectronics; Rapid thermal processing; Software packages; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location
Seattle, WA
ISSN
0569-5503
Print_ISBN
0-7803-4526-6
Type
conf
DOI
10.1109/ECTC.1998.678748
Filename
678748
Link To Document