Design and analysis of a 6 GHz chip antenna on glass substrates for integration with RF/wireless microsystems

Author

Mendes, P.M. ; Bartek, M. ; Burghartz, J.N. ; Correia, J.H.

Author_Institution

Dept. of Ind. Electron., Univ. of Minho, Portugal

Volume

2

fYear

2003

fDate

22-27 June 2003

Firstpage

667

Abstract

We report on design and characterization of chip-size antennas for operation at 6 GHz and use in wireless microsystems. Use of a glass substrate and application of wafer-level chip-scale packaging (WLCSP) techniques like adhesive wafer bonding and through-wafer electrical via formation, combined with the selected antenna type allows on-chip integration and is the main issue of our work. A short-range wireless link between two systems both equipped with a 11.7/spl times/l2.4 mm/sup 2/ patch antenna (measured characteristics: 6 GHz central frequency, 100 MHz bandwidth @ -10 dB, 3 dB gain, 51% efficiency) realized on a Coming Pyrex #7740 glass substrate is demonstrated.

Keywords

active antennas; chip scale packaging; micromechanical devices; microstrip antennas; wafer bonding; 100 MHz; 3 dB; 6 GHz; MEMS technology; adhesive wafer bonding; chip-size antennas; glass substrate; on-chip integration; patch antenna; short-range wireless link; silicon-compatible substrate; through-wafer electrical via formation; transmission line model; wafer-level chip-scale packaging; wireless microsystems; Antenna measurements; Chip scale packaging; Frequency measurement; Gain measurement; Glass; Patch antennas; Radio frequency; Semiconductor device measurement; Wafer bonding; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium, 2003. IEEE

Conference_Location

Columbus, OH, USA

Print_ISBN

0-7803-7846-6

Type

conf

DOI

10.1109/APS.2003.1219324

Filename

1219324