DocumentCode
1840167
Title
Visco-elastic-plastic properties and constitutive modeling of underfills
Author
Qian, Zhengfang ; Yang, Jian ; Liu, Sheng
Author_Institution
Dept. of Mech. Eng., Wayne State Univ., Detroit, MI, USA
fYear
1998
fDate
25-28 May 1998
Firstpage
969
Lastpage
974
Abstract
The thermo-mechanical testing of HYSOL FP4526 underfill, a filled polymer, is reported, including the details of sample preparation and test procedures. Both strain rate and temperature dependence are found for the Young´s modulus of the underfill. The constitutive framework proposed for solder alloys (Qian and Liu, 1997) is, for the first time, applied successfully to the thermo-mechanical properties of HYSOL FP4526 in this paper. Excellent agreement between model predictions and experimental data is achieved
Keywords
Young´s modulus; creep testing; encapsulation; filled polymers; flip-chip devices; integrated circuit packaging; integrated circuit reliability; tensile testing; HYSOL FP4526; Young´s modulus; constitutive modeling; filled polymer; sample preparation; strain rate; thermo-mechanical testing; underfills; visco-elastic-plastic properties; Capacitive sensors; Curing; Databases; Flip chip; Mechanical factors; Plastic packaging; Polymers; Soldering; Testing; Thermomechanical processes;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location
Seattle, WA
ISSN
0569-5503
Print_ISBN
0-7803-4526-6
Type
conf
DOI
10.1109/ECTC.1998.678826
Filename
678826
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