• DocumentCode
    1840865
  • Title

    Test Strategy for RF & Microwave Semiconductor Devices for Wireless Communications Market

  • Author

    Niedzwiecki, Antoni C.

  • Author_Institution
    Hewlett-Packard Company, Communications Components Division, 39201 Cherry Street, MS NK10, Newark, California 94560
  • Volume
    27
  • fYear
    1995
  • fDate
    19-19 May 1995
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    Today¿s RF and microwave semiconductor devices are being designed and manufactured in a new environment shaped in large measure by economic pressures. Prices are determined by the market and competition is intense. To be successful companies must minimize the amount of time needed to define, design, and document new products, the time needed to set up manufacturing lines, ramp-up production and introduce new products to the market. The emphasis is on manufacturing cost and product quality. Performance has to be just right, that is good enough for the intended application, as opposed to setting new records. To be successful one must put in place the right combination of manufacturing cost and capacity. Strategies employed here include designs resulting in the smallest possible die size, the utilization of plastic packages and process automation.
  • Keywords
    Circuit testing; Costs; Manufacturing processes; Microwave devices; Packaging; Radio frequency; Semiconductor device manufacture; Semiconductor device testing; Semiconductor devices; Wireless communication;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ARFTG Conference Digest-Spring, 45th
  • Conference_Location
    Orlando, FL, USA
  • Print_ISBN
    0-7803-5686-1
  • Type

    conf

  • DOI
    10.1109/ARFTG.1995.327098
  • Filename
    4119775