Low temperature cofired ceramic: an enabler of high power RF integrated amplifiers

Author

Piel, P.-M. ; Estes, J. ; Marshall, S. ; Funk, G. ; Pavio, A.

Author_Institution

Motorola Inc., Tempe, AZ, USA

Volume

3

fYear

2002

fDate

2-7 June 2002

Firstpage

1557

Abstract

Multi-layer ceramic technologies have been viewed recently as an enabler to increase the electrical functionality in a cost effective manner for high power discrete transistors. High power applications have stringent requirements on conductor losses, thermal characteristics and repeatability of design. We present a characterization of these factors and a preliminary definition of the boundary conditions for use in RF integrated amplifiers.

Keywords

UHF integrated circuits; UHF power amplifiers; ceramic packaging; power amplifiers; radiofrequency amplifiers; LTCC electrical modeling; LTCC substrates; LTCC technology; boundary conditions; conductor losses; design repeatability; high power RF integrated amplifiers; high power applications; low temperature cofired ceramic; multi-layer ceramic technologies; thermal characteristics; Capacitors; Ceramics; Computational modeling; Dielectric losses; High power amplifiers; Inductors; Packaging; Radio frequency; Radiofrequency amplifiers; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2002 IEEE MTT-S International

Conference_Location

Seattle, WA, USA

ISSN

0149-645X

Print_ISBN

0-7803-7239-5

Type

conf

DOI

10.1109/MWSYM.2002.1012153

Filename

1012153