DocumentCode
1841264
Title
Packaging aspects of the Jitney parallel optical interconnect
Author
Cohen, M.S. ; Johnson, G.W. ; Kuchta, D.M. ; Pepeljugoski, Petar K ; Trewhella, J.W. ; Ouimet, S.E. ; Spanoudis, S.L.
Author_Institution
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fYear
1998
fDate
25-28 May 1998
Firstpage
1206
Lastpage
1215
Abstract
The Jitney parallel optical interconnect is a prototype 20-channel wide, low cost data link, designed for operation at speeds up to one Gbyte/s over distances approaching 100 meters. The package is based on (1) an inexpensive overmolded leadframe, (2) passive optical alignment, and (3) plastic molded parts. The packaging challenges in the fabrication of the components, their assembly, and in the achievement of the performance goals are described
Keywords
assembling; moulding; optical fibre couplers; optical interconnections; packaging; 1 Gbyte/s; 100 m; Jitney parallel optical interconnect; assembly; low cost data link; overmolded leadframe; packaging aspects; passive optical alignment; performance goals; plastic molded parts; Costs; High speed optical techniques; Optical arrays; Optical crosstalk; Optical fiber cables; Optical fiber couplers; Optical interconnections; Optical receivers; Optical transmitters; Packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location
Seattle, WA
ISSN
0569-5503
Print_ISBN
0-7803-4526-6
Type
conf
DOI
10.1109/ECTC.1998.678877
Filename
678877
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