• DocumentCode
    1842517
  • Title

    Micro-electro-mechanical relays-design concepts and process demonstrations

  • Author

    Lee, Han S. ; Leung, Chi H. ; Shi, Jenny ; Chang, Shih-Chia

  • Author_Institution
    Delphi Res. Labs., Shelby Township, MI, USA
  • fYear
    2004
  • fDate
    20-23 Sept. 2004
  • Firstpage
    242
  • Lastpage
    247
  • Abstract
    MEMS relays designed for automotive applications were investigated and various fabrication techniques reviewed. Several micro-relay structures, of approximately 2 mm×1 mm×0.01 mm, were then made by electroforming with copper as the structural part and gold plated copper as the electrical contact part. Electrostatic actuation was achieved in all designs and on-off switching of small electrical loads (up to 1A, 12 VDC) tested. Various cleanroom electroforming and cleaning processes were discussed to improve contact resistance and structure durability. The various designs were compared for ease of fabrication, electrostatic actuation and switching performance. The feasibility of such MEMS relays in automotive applications was evaluated.
  • Keywords
    automotive electronics; clean rooms; cleaning; contact resistance; copper; durability; electrical contacts; electroforming; electrostatic actuators; gold; microrelays; 1 A; 12 V; Au-Cu; Cu; MEMS relays; automotive applications; cleaning processes; cleanroom electroforming; contact resistance; electrical contact part; electrostatic actuation; electrostatic switching; gold plated copper; microelectromechanical relays design; microrelay structures; process demonstrations; structure durability; Automotive applications; Contacts; Copper; Electrostatic actuators; Fabrication; Gold; Micromechanical devices; Microrelays; Relays; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Contacts, 2004. Proceedings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts
  • Print_ISBN
    0-7803-8460-1
  • Type

    conf

  • DOI
    10.1109/HOLM.2004.1353125
  • Filename
    1353125