• DocumentCode
    1844059
  • Title

    Accurate Package Modeling Based on S-Parameter Measurements

  • Author

    Lin, Fujiang ; Iyer, Mahadevan Krishna ; Ma, Huainan ; Tan, Khen Sang ; Kasashima, Masaaki ; Shibata, Junichi ; Nakamura, Hiroshi

  • Author_Institution
    Institute of Microelectronics, 11 Science Park Road, Singapore 117685, Singapore
  • Volume
    31
  • fYear
    1997
  • fDate
    35582
  • Firstpage
    191
  • Lastpage
    200
  • Abstract
    This paper presents experimental techniques for accurate package modeling including full L and C matrix characterisation based on VNA technique using RF probe station. Both package lead and bond wire parasitics are considered and determined separately. Advanced equivalent circuit models are developed for RFIC design which has been proven for first-pass success in packaged IC testing.
  • Keywords
    Bonding; Circuit testing; Equivalent circuits; Integrated circuit modeling; Packaging; Probes; Radio frequency; Radiofrequency integrated circuits; Scattering parameters; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ARFTG Conference Digest-Spring, 49th
  • Conference_Location
    Denver, CO, USA
  • Print_ISBN
    0-7803-5686-1
  • Type

    conf

  • DOI
    10.1109/ARFTG.1997.327228
  • Filename
    4119913
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1844059