Characteristics of ALD-TaN thin films using a novel precursors for copper metallization

Author

Kyung In Choi ; Byung Hee Kim ; Sang Woo Lee ; Jong Myeong Lee

Author_Institution

Semicond. R&D, Samsung Electron. Co. Ltd., Kyungki, South Korea

fYear

2003

fDate

2-4 June 2003

Firstpage

129

Lastpage

131

Abstract

ALD-TaN thin films derived from tert-buthyIimidotrisdiethyl-amidotantalum (TBTDET) and tert-amylimidotrisdim-ethylamidotantalum (TAIMATA) precursors for the diffusion barrier in Cu interconnects were developed. The deposition rate of the ALD-TaN process was saturated at 0.4 Å /cycle in a temperature range between 200°C and 250°C with TBTDET and at 0.2 Å/cycle in a temperature range between 150°C and 200°C with TAIMATA. Both precursors provided roughly comparable film properties such as not only excellent conformality but also composition and structure characterized by XPS and XRD, respectively. ALD-TaN films obtained from above precursors yield low via resistance in aluminum interconnects. However, relatively high via resistance was resulted upon Cu integration as compared to PVD-TaN and Al metallization. The superior diffusion barrier characteristic on Cu metallization was observed with ALD-TaN by BTS result in comparison to the conventional PVD-TaN.

Keywords

X-ray diffraction; X-ray photoelectron spectra; atomic layer deposition; copper; diffusion barriers; integrated circuit metallisation; tantalum compounds; thin films; 150 to 250 degC; ALD-TaN thin films; Cu; Cu integration; Cu interconnects; TaN; XPS; XRD; aluminum interconnects; copper metallization; deposition rate; superior diffusion barrier; Artificial intelligence; Copper; Integrated circuit interconnections; Metallization; Semiconductor thin films; Sputtering; Temperature dependence; Temperature distribution; Transistors; X-ray scattering;

fLanguage

English

Publisher

ieee

Conference_Titel

Interconnect Technology Conference, 2003. Proceedings of the IEEE 2003 International

Print_ISBN

0-7803-7797-4

Type

conf

DOI

10.1109/IITC.2003.1219732

Filename

1219732