DocumentCode
1845074
Title
A semi-lumped balun fabricated by low temperature co-fired ceramic
Author
Ching-Wen Tang ; Chi-Yang Chang
Author_Institution
Phycomp Taiwan Ltd., Kaohsiung, Taiwan
Volume
3
fYear
2002
fDate
2-7 June 2002
Firstpage
2201
Abstract
A new chip-type multi-layer ceramic balun is presented in this paper. This balun is designed in the ISM band and fabricated using low temperature co-fired ceramic (LTCC) technology. It involves the semi-lumped concept and the multi-layer structure to realize the LTCC-MLC balun. The symmetric structure provides the excellent characteristics of phase balance and amplitude balancing. Measured results of the LTCC-MLC balun match well with the computer simulation.
Keywords
UHF circuits; baluns; ceramic packaging; equivalent circuits; 2.25 to 2.65 GHz; LTCC technology; LTCC-MLC balun; MIM capacitors; RF components; amplitude balancing; chip-type balun; low temperature co-fired ceramic technology; multi-layer ceramic balun; phase balance; semi-lumped concept; symmetric structure; Ceramics; Coupling circuits; Distributed parameter circuits; Fabrication; Impedance matching; Inductance; MIM capacitors; Radio frequency; Temperature; Transmission lines;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 2002 IEEE MTT-S International
Conference_Location
Seattle, WA, USA
ISSN
0149-645X
Print_ISBN
0-7803-7239-5
Type
conf
DOI
10.1109/MWSYM.2002.1012309
Filename
1012309
Link To Document