DocumentCode
1845508
Title
Microfabrication of asymmetric planar electrodes for long-term glucose monitoring
Author
Yin, Chih-Hsiu ; Parng, Shaw-Hwa ; Chen, Jui-Tse ; Lee, Kun-Feng ; Chen, Chu-Hsuan ; Chou, Tsung-Che ; Chuang, Yun-Ju ; Lee, Hom-Chin ; Lin, Yuh-Jiuan
Author_Institution
Med. Electron. & Device Technol. Center, Ind. Technol. Res. Inst., Hsinchu, Taiwan
fYear
2009
fDate
18-21 Oct. 2009
Firstpage
53
Lastpage
56
Abstract
In the present study, we proposed a design of asymmetric planar electrodes for long-term monitoring of glucose level at body temperature. The asymmetric planar electrodes were fabricated by thin film technology on glass and cut as chip sensor. The glass-based chip sensor was further immobilized with glucose oxidase for glucose measuring. To investigate the stability of the glass-based chip sensor, we performed a long-term study and compared with a commercial polymer sensor. All of the experiments were carried out in phosphate buffer solution at 37°C. The result indicated that the glass-based chip senor was more stable in background signal than a commercial polymer sensor during a 18 days of study. The chip senor immobilized with glucose oxidase showed fast response time and broad detection range for glucose measurement. The present study demonstrated that our design of asymmetric planar electrodes was suitable for developing a glucose sensor with long-term stability.
Keywords
biomedical electrodes; biomedical measurement; biosensors; chemical sensors; microfabrication; patient monitoring; sugar; asymmetric planar electrode microfabrication; asymmetric planar electrodes; body temperature; glass-based chip sensor; glucose measurement; glucose oxidase; long-term glucose monitoring; phosphate buffer solution; temperature 37 degC; thin film technology; time 18 day; Biomedical monitoring; Monitoring; Semiconductor device measurement; Asymmetric planar electrode; glucose sensor; long-term monitoring; microfabrication;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Molecular Medicine and Engineering (NANOMED), 2009 IEEE International Conference on
Conference_Location
Tainan
Print_ISBN
978-1-4244-5528-7
Type
conf
DOI
10.1109/NANOMED.2009.5559121
Filename
5559121
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