• DocumentCode
    1845699
  • Title

    A Test Board for Multiport Immittance Measurement and Characterization of RF-IC Packages

  • Author

    Tripathi, Alok ; Lutz, Rick ; Tripathi, V.K. ; Wu, Henry Hungjen ; Meyer, Jeffrey W. ; Hutchison, Brian

  • Author_Institution
    Department of Electrical & Computer Engineering, Oregon State University, Corvallis, OR 97331
  • Volume
    33
  • fYear
    1998
  • fDate
    35947
  • Firstpage
    159
  • Lastpage
    162
  • Abstract
    An experimental technique based on the measurement of two port scattering parameters for the characterization of electrically small RF-IC package is presented. The procedure is based on a novel test board design to facilitate extraction of n-port admittance and impedance matrix parameters using two port network analyzer scattering parameter measurements. An optimization routine is used to extract the SPICE based equivalent circuit model that includes the mutual coupling effects present in the RF-IC package pins.
  • Keywords
    Admittance measurement; Circuit testing; Electric variables measurement; Equivalent circuits; Impedance measurement; Mutual coupling; Packaging; Pins; SPICE; Scattering parameters;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ARFTG Conference Digest-Spring, 51st
  • Conference_Location
    Baltimore, MD, USA
  • Print_ISBN
    0-7803-5686-1
  • Type

    conf

  • DOI
    10.1109/ARFTG.1998.327297
  • Filename
    4119986
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1845699