• DocumentCode
    1845879
  • Title

    Measuring interface thermal resistance values by transient testing

  • Author

    Rencz, Marta ; Székely, Vladimir ; Farkas, Gabor ; Courtois, Bernard

  • Author_Institution
    Micred Ltd., Budapest, Hungary
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    136
  • Lastpage
    141
  • Abstract
    A method is presented for detecting increased thermal resistance values within a heat conduction path with the help of transient thermal measurements. After summarizing the theoretical background of structure function evaluation it is demonstrated how to determine partial thermal resistances in the cases when one dimensional heat flow may be assumed. The paper presents a typical structure developed to measure small thermal resistance values with the help of the presented method. Simulated results demonstrate the feasibility of the suggested method, and measured examples demonstrate the applicability.
  • Keywords
    heat sinks; packaging; thermal resistance; transient analysis; heat conduction path; interface thermal resistance value measurement; one dimensional heat flow; package; partial thermal- resistances; structure function evaluation; transient testing; Area measurement; Capacitance measurement; Conductivity measurement; Density measurement; Electrical resistance measurement; Resistance heating; Testing; Thermal conductivity; Thermal resistance; Time measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
  • ISSN
    1089-9870
  • Print_ISBN
    0-7803-7152-6
  • Type

    conf

  • DOI
    10.1109/ITHERM.2002.1012449
  • Filename
    1012449