DocumentCode
1846577
Title
Thermal design methodology for high-heat-flux single-phase and two-phase micro-channel heat sinks
Author
Qu, Weilin ; Mudawar, Issam
Author_Institution
Purdue Univ. Int. Electron. Cooling Alliance, West Lafayette, IN, USA
fYear
2002
fDate
2002
Firstpage
347
Lastpage
359
Abstract
This paper explores several issues important to the thermal design of single-phase and two-phase micro-channel heat sinks. The first part of the paper concerns single-phase heat transfer in rectangular micro-channels. Experimental results are compared with predictions based on both numerical as well as fin analysis models. While the best agreement between predictions and experimental results was achieved with numerical simulation, a few of the fin models are found to provide fairly accurate predictions. The second part of the paper focuses on predicting the incipient boiling heat flux. A comprehensive model based on bubble departure and superheat criteria is developed and validated with experimental data. The incipience model is capable of predicting the location, shape and size of bubbles departing in rectangular micro-channels. In the third part of the study, an analytical model is developed to predict pressure drop across a two-phase micro-channel heat sink. This model provides a detailed assessment of pressure drop concerns with two-phase micro-channels, including compressibility, flashing and choking. Overall, the present study provides important guidelines concerning practical implementation of micro-channel heat sinks in high-heat-flux electronic cooling applications.
Keywords
boiling; bubbles; cooling; heat sinks; two-phase flow; analytical model; bubble departure; fin analysis; high-heat-flux electronic cooling; incipient boiling heat flux; numerical simulation; pressure drop; single-phase microchannel heat sink; superheat criteria; thermal design; two-phase microchannel heat sink; Design methodology; Drag; Electronics cooling; Heat sinks; Heat transfer; Multilevel systems; Predictive models; Temperature; Thermal conductivity; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
ISSN
1089-9870
Print_ISBN
0-7803-7152-6
Type
conf
DOI
10.1109/ITHERM.2002.1012478
Filename
1012478
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