• DocumentCode
    1846818
  • Title

    Characterization of Surface Mount Components at Microwave Frequencies using Wafer Probes

  • Author

    Godshalk, Ed ; Sundberg, Garth

  • Author_Institution
    Maxim Integrated Products and Oregon State University
  • Volume
    35
  • fYear
    1999
  • fDate
    36312
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    Calibrated measurements may be performed in a printed circuit board (PCB) environment using microstrip elements and ultra small surface mount components as calibration standards. The calibration technique allows surface mount components and packages to be characterized from VHF to microwave frequencies. The use of microwave wafer probes for connection to the PCB is described.
  • Keywords
    Calibration; Coplanar waveguides; Inductance; Measurement standards; Microstrip; Microwave frequencies; Packaging; Probes; Surface-mount technology; VHF circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ARFTG Conference Digest-Spring, 53rd
  • Conference_Location
    Anaheim, CA, USA
  • Print_ISBN
    0-7803-5686-1
  • Type

    conf

  • DOI
    10.1109/ARFTG.1999.327346
  • Filename
    4120039
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1846818