• DocumentCode
    1847973
  • Title

    Energy efficient cooling of notebook computers

  • Author

    Yazawa, Kazuaki ; Bar-Cohen, Avram

  • Author_Institution
    Sony Corp., Tokyo, Japan
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    785
  • Lastpage
    791
  • Abstract
    The majority of today\´s leading-edge notebook computers relies on heat pipes for internal spreading and use forced convection, with micro-fans, to reject heat to the ambient. Such techniques have worked efficiently in the relatively flat form factor of these computers, but may not be capable of providing high heat flux cooling in ever shrinking volumes. Moreover, the power limitations of portable computers, as well as growing concern for the environment, make it desirable that the requisite thermal management be accomplished with a minimum expenditure of energy. It is, thus, essential that the developers of such notebook computers follow a rigorous design methodology and achieve an optimal design for energy and space savings. This paper illustrates a "top down" thermal design methodology aimed at achieving energy efficient thermal management in a compact notebook computer, while satisfying the requirements for highly integrated design. The paper begins with a review of the passive cooling limits, and uses analytic models to determine the thermal performance that can be attained in a standard notebook form factor. Numerical modeling, along with additional analysis, is used to design the optimum compact active cooling system for both for space and energy efficiency.
  • Keywords
    cooling; energy conservation; forced convection; notebook computers; thermal management (packaging); analytical model; cooling system; energy efficiency; forced convection; notebook computer; numerical model; portable computer; thermal design; thermal management; Cooling; Design methodology; Energy efficiency; Energy management; Environmental management; Numerical models; Performance analysis; Portable computers; Thermal factors; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
  • ISSN
    1089-9870
  • Print_ISBN
    0-7803-7152-6
  • Type

    conf

  • DOI
    10.1109/ITHERM.2002.1012534
  • Filename
    1012534