DocumentCode
1848077
Title
A meshfree framework for solder droplet shape prediction
Author
Zhang, Xuefeng ; Subbarayan, Ganesh
Author_Institution
Colorado Univ., Boulder, CO, USA
fYear
2002
fDate
2002
Firstpage
819
Lastpage
826
Abstract
In this paper we present a general Non-Uniform-Rational-B-Spline (NURBS) based framework and a set of example problems for solving solder droplet shape. In the recent years, there has been a growing body of literature in meshfree methods. Much of this research is driven by a need to solve problems such as those occurring in fracture where a change in geometry (due to, for instance, crack extension) has necessitated re-meshing in traditional discretization schemes. Large, iterative, changes in geometry are in general characteristic of other class of problems such as large deformation analysis and optimal design. A problem similar in nature to the optimal design problems is the droplet shape problem, where the equilibrium configuration is determined as that possessing the least potential energy. NURBS curves and higher order entities are among the most sophisticated available at the present time to represent complex geometry. The Bernstein polynomials that serve as the basis function in NURBS can be shown to be a partition of unity representation. Thus, the NURBS representation provides an appropriate framework for the representation of field quantities in a meshfree analysis. Such an analysis scheme will be geometry-based and is therefore a very natural one in problems involving large changes in geometry such as the droplet shape prediction problems since changes in geometry need not be accompanied by remeshing. Here we will describe a general purpose java-based code for carrying out optimal design problems. We will illustrate the code using several example problems for solder droplet shape prediction.
Keywords
drops; soldering; splines (mathematics); Bernstein polynomial; Java code; NURBS model; design optimization; mesh-free method; nonuniform rational B-spline; numerical discretization; potential energy; solder droplet shape; Assembly; Finite element methods; Geometry; Potential energy; Shape; Soldering; Spline; Surface reconstruction; Surface tension; Surface topography;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2002. ITHERM 2002. The Eighth Intersociety Conference on
ISSN
1089-9870
Print_ISBN
0-7803-7152-6
Type
conf
DOI
10.1109/ITHERM.2002.1012539
Filename
1012539
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