DocumentCode
1850646
Title
Integration of tunable capacitors and bonded-wires for contactless RF switch and tunable filter
Author
Chen, Shih-Jui ; Lee, Chuang-Yuan ; Kim, Eun Sok
Author_Institution
Dept. of Electr. Eng.-Electrophys., Univ. of Southern California, Los Angeles, CA, USA
fYear
2009
fDate
21-25 June 2009
Firstpage
545
Lastpage
548
Abstract
This paper describes a contactless RF MEMS switch, composed of two surface-micromachined tunable capacitors and two bonded-wire inductors, which can achieve a power isolation ratio of 10 dB with a capacitance variation of mere 4:1 over a narrow bandwidth near 2.4 GHz. This novel approach of using inductors eases the deflection requirement for the deformable bridge for the variable capacitor, and allows piezoelectric ZnO film to be used to deflect the capacitor bridge to vary the air gap, thus yielding a contactless RF switch.
Keywords
capacitors; circuit tuning; crystal filters; micromachining; microswitches; piezoelectric thin films; radiofrequency filters; wide band gap semiconductors; wires; zinc compounds; ZnO; bonded wires; contactless RF switch; deformable bridge; piezoelectric film; surface-micromachined tunable capacitors; tunable filter; Bandwidth; Bonding; Bridge circuits; Capacitance; Capacitors; Contacts; Filters; Radio frequency; Radiofrequency microelectromechanical systems; Switches; RF MEMS switch; tunable capacitor; tunable filter; wire-bond inductor;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location
Denver, CO
Print_ISBN
978-1-4244-4190-7
Electronic_ISBN
978-1-4244-4193-8
Type
conf
DOI
10.1109/SENSOR.2009.5285382
Filename
5285382
Link To Document