A highly miniaturized receiver front-end hybrid IC using on-chip high-dielectric constant capacitors for mobile communication equipment

Author

Nakatsuka, T. ; Itoh, J. ; Yamamoto, S. ; Yoshida, T. ; Nishitsuji, M. ; Uda, T. ; Nishii, K. ; Ishikawa, O.

Author_Institution

Semicond. Res. Center, Matsushita Commun. Ind. Co. Ltd., Osaka, Japan

fYear

1995

fDate

15-16 May 1995

Firstpage

85

Lastpage

88

Abstract

A highly miniaturized and low power consumption receiver front-end hybrid IC(HIC) including input matching circuits for 880 MHz bands using on-chip high-dielectric constant (/spl epsi//sub r/) capacitors has been newly developed. The HIC is composed of a GaAs IC chip and a ceramic substrate with spiral inductors on its surface. The HIC showed conversion gain of 20.2 dB and noise figure of 4.2 dB at supply voltage of 2.7 V and dissipation current of 3.7 mA. The HIC measures only 5.0 mm/spl times/5.0 mm/spl times/1.0 mm.<>

Keywords

UHF integrated circuits; hybrid integrated circuits; land mobile radio; radio receivers; 2.7 V; 20.2 dB; 3.7 mA; 4.2 dB; 880 MHz; GaAs; GaAs IC chip; UHF IC; ceramic substrate; hybrid IC; input matching circuits; low power consumption; miniaturized receiver front-end; mobile communication equipment; onchip high-dielectric constant capacitors; spiral inductors; Capacitors; Ceramics; Dielectric substrates; Energy consumption; Gain; Gallium arsenide; Hybrid integrated circuits; Impedance matching; Inductors; Spirals;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave and Millimeter-Wave Monolithic Circuits Symposium, 1995. Digest of Papers., IEEE 1995

Conference_Location

Orlando, FL, USA

Print_ISBN

0-7803-2590-7

Type

conf

DOI

10.1109/MCS.1995.470985

Filename

470985