DocumentCode
1851572
Title
A digital accelerometer using a microscale liquid-metal droplet in photosensitive glass channel
Author
Yoo, Kwanghyun ; Lee, Chan ; Kim, Joonwon
Author_Institution
Dept. of Mech. Eng., Pohang Univ. of Sci. & Technol. (POSTECH), Pohang, South Korea
fYear
2009
fDate
21-25 June 2009
Firstpage
676
Lastpage
679
Abstract
This paper introduces the operation concept, fabrication and feasibility of the MEMS digital accelerometer using a microscale liquid-metal (LM) droplet in a microstructured glass channel formed by a photosensitive (PS) glass. Our device employs the advantageous properties of the LM droplet (i.e., high surface tension, high density and electrical conduction) and the PS glass (i.e., photo-definable anisotropic etching and mechanical stability). Especially, the photo-definable property provides a simple and convenient process to make an anisotropically-etched glass channel in the device. Moreover, microstructures are formed uniformly and simultaneously on the glass channel surface during the etching process, which provides easy movement of the LM droplet on the channel surface. Integrating the LM droplet inside the microstructured glass channel, a dramatically simplified yet effective mechanism of the digital accelerometer is realized.
Keywords
accelerometers; drops; electrical conductivity; micromechanical devices; surface tension; MEMS digital accelerometer; anisotropically-etched glass channel; electrical conduction; mechanical stability; microscale liquid-metal droplet; microstructured glass channel; photo-definable anisotropic etching; photosensitive glass channel; surface tension; Accelerometers; Anisotropic magnetoresistance; Etching; Fabrication; Glass; Mechanical factors; Micromechanical devices; Microstructure; Stability; Surface tension; accelerometer; contact angle hysteresis; liquid-metal droplet; non-wetting; photosensitive glass;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
Conference_Location
Denver, CO
Print_ISBN
978-1-4244-4190-7
Electronic_ISBN
978-1-4244-4193-8
Type
conf
DOI
10.1109/SENSOR.2009.5285415
Filename
5285415
Link To Document