DocumentCode
1852248
Title
Designing-in plastics, polymers, and novel materials in your electronics products
Author
Schott, Nick
Author_Institution
Inst. for Plastics Innovation, Massachusetts Univ., Lowell, MA, USA
fYear
1995
fDate
21-23 Jun 1995
Firstpage
303
Lastpage
307
Abstract
The author presents a brief overview of the applications of plastics in electronics packaging. He deals with materials processing and properties and encapsulation of integrated circuit devices and briefly discusses the role of the Institute for Plastics Innovation
Keywords
encapsulation; integrated circuit packaging; plastic packaging; polymers; Institute for Plastics Innovation; electronics packaging; encapsulation; integrated circuit devices; materials processing; materials properties; overview; plastics packaging; polymers; Conducting materials; Construction industry; Electronics industry; Electronics packaging; Industrial electronics; Manufacturing industries; Plastic products; Plastics industry; Polymers; Technological innovation;
fLanguage
English
Publisher
ieee
Conference_Titel
Electro/95 International. Professional Program Proceedings.
Conference_Location
Boston, MA
Print_ISBN
0-7803-2633-4
Type
conf
DOI
10.1109/ELECTR.1995.471031
Filename
471031
Link To Document