• DocumentCode
    1852412
  • Title

    Multi-factory capacity planning in semiconductor assembly and test manufacturing with multiple-chip products

  • Author

    Sweat, Sean ; Niu, Sophia ; Zhang, Mike Tao ; Zhang, Zhicong ; Zheng, Li

  • Author_Institution
    Dept. Civil Eng., MIT, Cambridge, MA
  • fYear
    2006
  • fDate
    8-10 Oct. 2006
  • Firstpage
    247
  • Lastpage
    252
  • Abstract
    Capacity planning determines the optimal product mix based on the available tool sets and allocates production capacity according to the forecasted demands for the next few months. MaxIt is the previous capacity planning system for Intel´s Flash Product Group (FPG) Assembly & Test Manufacturing (ATM). It only applied to single product family scenarios with simple process routing. However, new Celluar Handhold Group (CHG) products need to go through flexible and reentrant ATM routes. In this paper, we introduce MaxItPlus, which is an enhanced MaxIt using MILP (mixed integer linear programming) to conduct capacity planning of multiple product families with mixed process routes in a multifactory ATM environment. We also present the detailed mathematical formulation, the system architecture, and implementation results. The project will help Intel global Flash ATM to achieve a single and efficient capacity planning process for all FPG and CHG products and gain $10 M in marginal profit (as determined by the finance department)
  • Keywords
    capacity planning (manufacturing); integer programming; linear programming; semiconductor device manufacture; Celluar Handhold Group; Intel Flash Product Group; MaxItPlus; capacity planning system; mixed integer linear programming; multifactory capacity planning; multiple-chip products; production capacity; semiconductor assembly; test manufacturing; Assembly systems; Capacity planning; Demand forecasting; Manufacturing; Mixed integer linear programming; Production; Routing; Semiconductor device manufacture; Semiconductor device testing; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Automation Science and Engineering, 2006. CASE '06. IEEE International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-0310-3
  • Electronic_ISBN
    1-4244-0311-1
  • Type

    conf

  • DOI
    10.1109/COASE.2006.326888
  • Filename
    4120354