DocumentCode
1854260
Title
Preparation and electrical properties of titania nanowire-epoxy nanocomposites
Author
Xie, Q. ; Niu, C.-M. ; Cheng, Y.-H.
Author_Institution
State Key Lab. of Electr. Insulation & Power Equip., Xi´an Jiaotong Univ., Xi´an, China
fYear
2015
fDate
7-10 June 2015
Firstpage
450
Lastpage
453
Abstract
This work investigates the effects of semiconducting TiO2 nanowires on electrical properties of epoxy. TiO2 nanowires with diameters around 50 nm and length between 1 and 3 micrometer were prepared by a hydrothermal process, and then uniformly dispersed into epoxy matrix through a solution route by sonication. After cured by temperature programed heating, the electrical properties of the samples, including dc volume resistivity, dielectric permittivity dependence on frequencies, and Thermally Stimulated Discharge Current (TSDC) were measured. These properties are compared to those measured from SiO2 nanoparticle-epoxy and TiO2 nanoparticle-epoxy composites prepared using the same method. Results of this study show some interesting dielectric characteristics and confirm the fact that the adding of TiO2 nanowires has a large influence on their dielectric properties.
Keywords
electrical resistivity; filled polymers; nanocomposites; nanofabrication; nanowires; permittivity; resins; semiconductor doped polymers; thermally stimulated currents; titanium compounds; wide band gap semiconductors; TiO2; dc volume resistivity; dielectric permittivity dependence; electrical properties; hydrothermal process; semiconducting titania nanowire effects; size 1 mum to 3 mum; solution route; sonication; temperature programed heating; thermally stimulated discharge current; titania nanowire-epoxy nanocomposites; Conductivity; Dielectrics; Nanocomposites; Nanowires; Permittivity; Polymers; Temperature measurement; TSDC; TiO2 ; electrical; epoxy; nanowire; polymer;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation Conference (EIC), 2015 IEEE
Conference_Location
Seattle, WA
Print_ISBN
978-1-4799-7352-1
Type
conf
DOI
10.1109/ICACACT.2014.7223521
Filename
7223521
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