A novel Parylene/Al/Parylene sandwich protection mask for HF Vapor release for micro electro mechanical systems

Author

Higo, A. ; Takahashi, K. ; Fujita, H. ; Nakano, Y. ; Toshiyoshi, H.

Author_Institution

Res. Center for Adv. Sci. & Technol., Univ. of Tokyo, Tokyo, Japan

fYear

2009

fDate

21-25 June 2009

Firstpage

196

Lastpage

199

Abstract

We have developed novel mask materials against HF Vapor release for MEMS/NEMS. Parylene-C has a tolerant material against moisture pass, and then, thin aluminum layer has also tolerant against HF vapor. We combined them together for high tolerance and we have successfully obtained completely non-etched silicon oxide layer under HF vapor exposure by Parylene/Al/Parylene sandwich structure.

Keywords

micromechanical devices; nanoelectromechanical devices; polymers; sandwich structures; silicon compounds; HF vapor release; MEMS/NEMS; Parylene-C; mask materials; microelectromechanical systems; non-etched silicon oxide layer; parylene/aluminium/parylene sandwich protection mask; thin aluminum layer; Aluminum; Etching; Hafnium; Mechanical systems; Micromechanical devices; Moisture; Optical microscopy; Protection; Sandwich structures; Silicon on insulator technology; HF vapor protection; HF vapor release technique; Parylene;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International

Conference_Location

Denver, CO

Print_ISBN

978-1-4244-4190-7

Electronic_ISBN

978-1-4244-4193-8

Type

conf

DOI

10.1109/SENSOR.2009.5285531

Filename

5285531