• DocumentCode
    1854635
  • Title

    Young´s modulus and fatigue lifetime improvements by diamond size effect on electroplated Ni-diamond nanocomposite

  • Author

    Huang, C.S. ; Cheng, Y.T. ; Yeh, C.J. ; Liu, H.K. ; Hsu, W.

  • Author_Institution
    Dept. of Mech. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2009
  • fDate
    21-25 June 2009
  • Firstpage
    180
  • Lastpage
    183
  • Abstract
    Fatigue and Young´s modulus characterizations have been investigated using the bending-test method on microsized cantilever-beam specimens made of electroplated Ni and Ni-diamond nanocomposites with different particle sizes (i.e. 350 nm and 50 nm in diameter). The experimental results show that electroplated Ni-diamond nanocomposite has slightly smaller fatigue strength than that of pure electroplated Ni due to the ductility reduction resulted by the nano-diamond particles. However, once the incorporated particle size of nano-diamond is reduced from 350 nm to 50 nm, it has been found that the electroplated Ni-diamond nanocomposite can have higher Young´s modulus (13.6% enhancement, i.e. 178GPa) and comparable fatigue strength (~2.4 GPa) with that of pure electroplated Ni.
  • Keywords
    Young´s modulus; diamond; electroplating; fatigue; nanocomposites; nanofabrication; nanostructured materials; nickel; Ni-C; Young´s modulus; bending-test method; diamond size effect; electroplated Ni-diamond nanocomposite; fatigue strength; microsized cantilever-beam specimens; nano-diamond particles; pressure 178 GPa; size 350 nm; size 50 nm; Computer aided engineering; Displacement control; Fabrication; Fatigue; Force measurement; Mechanical engineering; Micromechanical devices; Nanoscale devices; Silicon; Testing; Bending-test; Fatigue; MEMS; Nanocomposite; Thin film; Young´s modulus;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
  • Conference_Location
    Denver, CO
  • Print_ISBN
    978-1-4244-4190-7
  • Electronic_ISBN
    978-1-4244-4193-8
  • Type

    conf

  • DOI
    10.1109/SENSOR.2009.5285535
  • Filename
    5285535