• DocumentCode
    1855399
  • Title

    Comparison of millimeter wave dielectric measurement using various techniques

  • Author

    Afsar, M.N. ; Moonshiram, A. ; Yong Wang

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Tufts Univ., Medford, MA, USA
  • Volume
    4
  • fYear
    2003
  • fDate
    22-27 June 2003
  • Firstpage
    627
  • Abstract
    Four different systems namely the open resonator system, the DFTS, the BWO W-band spectrometer and the broadband free-space measurement system are used to compare the permittivity and loss tangent values obtained when several polymers are measured over the millimeter wave frequencies. Random and systematic error analysis are performed on permittivity and loss tangent values by comparing the dielectric data obtained from the four different systems. Uncertainty analysis is performed on a number of materials as nylon, plexiglass, high-density polyethylene, polypropylene and Teflon. Additionally, systematic error analysis is performed when such polymers as acrylic and fiberglass resin are compared at the W-band frequencies using the DFTS and the BWO W-band spectrometer.
  • Keywords
    Fourier transform spectroscopy; backward wave oscillators; dielectric loss measurement; measurement errors; millimetre wave measurement; permittivity measurement; polymers; BWO W-band spectrometer; Teflon; broadband free-space measurement; dispersive Fourier transform spectroscopy; high-density polyethylene; loss tangent; measurement techniques comparison; millimeter wave dielectric measurement; nylon; open resonator system; permittivity measurement; plexiglass; polymers; polypropylene; random error; systematic error; Dielectric loss measurement; Dielectric measurements; Error analysis; Frequency measurement; Loss measurement; Millimeter wave measurements; Millimeter wave technology; Permittivity measurement; Polymers; Spectroscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 2003. IEEE
  • Conference_Location
    Columbus, OH, USA
  • Print_ISBN
    0-7803-7846-6
  • Type

    conf

  • DOI
    10.1109/APS.2003.1220352
  • Filename
    1220352