• DocumentCode
    1855638
  • Title

    Degradation of printed circuit board coatings due to partial discharge

  • Author

    Emersic, Christopher ; Chao Zhang ; Cotton, Ian ; Lowndes, Robert ; Rowland, Simon ; Freer, Robert

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Univ. of Manchester, Manchester, UK
  • fYear
    2015
  • fDate
    7-10 June 2015
  • Firstpage
    420
  • Lastpage
    423
  • Abstract
    The use of power electronics associated with the drive toward higher voltages in more compact and lighter all-electric aircraft introduces new risks and failure modes. Boards are often coated for added protection; however, the performance and level of protection provided by various coatings in these environments, after some degree of degradation, is not well characterised. Partial discharge has been identified as a particularly significant and aggressive source of coating degradation which can lead to electrical failure. A series of experiments have attempted to characterise the magnitude and nature of damage from partial discharge on a silicone coating as a function of applied voltage above partial discharge inception. Simple coated boards designed around industry test standards (IPC2221A and IEC60664) were left to age and degrade while subjected to partial discharge of a given magnitude and were periodically observed under a microscope. The nature of the damage and its evolution was observed in a range of cases and these observations are presented.
  • Keywords
    coating techniques; partial discharges; power electronics; printed circuits; silicones; IEC60664; IPC2221A; coating degradation; electrical failure; industry test standard; partial discharge; power electronics; printed circuit board coating; silicone coating; Aerospace electronics; Aging; Coatings; Degradation; Partial discharges; Surface treatment; Testing; Aerospace; All-Electric Aircraft; PCB Coating; Partial Discharge; Power Electronics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference (EIC), 2015 IEEE
  • Conference_Location
    Seattle, WA
  • Print_ISBN
    978-1-4799-7352-1
  • Type

    conf

  • DOI
    10.1109/ICACACT.2014.7223586
  • Filename
    7223586