• DocumentCode
    1856393
  • Title

    Analysis of parameter-degradation data using life-data analysis programs

  • Author

    Chan, Chun Kin ; Boulanger, Michele ; Tortorella, Michael

  • Author_Institution
    AT&T Bell Labs., Holmdel, NJ, USA
  • fYear
    1994
  • fDate
    24-27Jan 1994
  • Firstpage
    288
  • Lastpage
    291
  • Abstract
    A new application of existing reliability software packages is proposed to analyze parameter-degradation data. This new implementation of existing tools is applicable to a large class of degradation phenomena described by the power law or the stretched exponential law. When these laws are used to model parameter-degradation paths, the parametric drift can be treated as an explanatory variable, on equal footing with conventional explanatory variables such as temperature, electrical stress, or humidity. Thin film integrated circuit resistor degradation data and the STAR (Statistical Analysis of Reliability) software package are used to illustrate the authors´ approach. Other degradation phenomena that can be studied using the proposed method include hot carrier degradation in metal-oxide-silicon (MOS) transistors, laser degradation, and degradation of light emitting diodes
  • Keywords
    circuit reliability; failure analysis; maximum likelihood estimation; parameter estimation; reliability theory; software packages; statistical analysis; thin film circuits; thin film resistors; MOS transistors; STAR software package; explanatory variable; hot carrier degradation; laser degradation; life data analysis programs; light emitting diodes; metal-oxide-silicon transistors; parameter degradation data; parametric drift; power law; reliability software packages; statistical analysis of reliability software package; stretched exponential law; thin film integrated circuit resistor degradation data; Application software; Data analysis; Degradation; Humidity; Resistors; Software packages; Statistical analysis; Stress; Temperature; Thin film circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability and Maintainability Symposium, 1994. Proceedings., Annual
  • Conference_Location
    Anaheim, CA
  • Print_ISBN
    0-7803-1786-6
  • Type

    conf

  • DOI
    10.1109/RAMS.1994.291122
  • Filename
    291122