• DocumentCode
    1857271
  • Title

    Supersonic cluster beam deposition as novel tool addressing Nano-On-Micro issue

  • Author

    Barborini, E. ; Vinati, S. ; Leccardi, M. ; Repetto, P. ; Decarli, M. ; Lorenzelli, L. ; Milani, P.

  • Author_Institution
    Tethis srl, Milan, Italy
  • fYear
    2009
  • fDate
    21-25 June 2009
  • Firstpage
    2058
  • Lastpage
    2061
  • Abstract
    Supersonic cluster beam deposition was used to integrate nanostructured oxide films onto silicon microstructures (microhotplates and microbridges), for batch production of conductimetric chemical sensors. Devices were characterized respect to oxidizing as well as reducting species, such as NO2, ethanol and hydrogen. Hybrid devices performing on the same micromachined platform either air flow measurement, temperature measurement, and chemical detection were also produced, by integrating the nanomaterials exclusively on the parts dedicated to chemical sensing. This research demonstrates the possibility of direct and high-throughput parallel integration of nanomaterials on micromachined parts and generally MEMS.
  • Keywords
    chemical sensors; chemical variables measurement; flow measurement; micromechanical devices; organic compounds; supersonic flow; temperature measurement; MEMS; NO2; Si; air flow measurement; chemical detection; conductimetric chemical sensors; ethanol; hydrogen; integrate nanostructured oxide films; microbridges; microhotplates; micromachined parts; nano-on-micro issue; nanomaterials; silicon microstructures; supersonic cluster beam deposition; temperature measurement; Chemical sensors; Conductive films; Ethanol; Hydrogen; Microstructure; Nanomaterials; Production; Semiconductor films; Silicon; Temperature measurement; Nanoparticle; beam; gas sensors; hard-mask; integration; microhotplates; micromachined parts; patterning; thin-film;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
  • Conference_Location
    Denver, CO
  • Print_ISBN
    978-1-4244-4190-7
  • Electronic_ISBN
    978-1-4244-4193-8
  • Type

    conf

  • DOI
    10.1109/SENSOR.2009.5285639
  • Filename
    5285639