DocumentCode
1857819
Title
Leading Edge Technology and Test Noise
Author
Takayuki, Katayama ; Ebihara, Kou ; Imaizumi, Goro
Author_Institution
Fujitsu Microelectron. Ltd.
fYear
2008
fDate
24-27 Nov. 2008
Firstpage
269
Lastpage
269
Abstract
The power consumption under test is paid to attention in recent years especially in advanced technology node. It is often reported that there are deep relation between the yield loss and power integrity, which is critical to circuit operation at testing. This is because structural test operates even more circuits than usual system operation.This issue will also be more critical according to process technology evolution. In this report, the amount of the noise at memory built-in self-test (BIST) and transition delay test (TDT) which are major method of structural test is observed. And its influence on device is considered.
Keywords
built-in self test; integrated circuit noise; integrated circuit testing; large scale integration; low-power electronics; power electronics; BIST; LSI; built-in self-test; power consumption; power integrity; power supply noise; process technology; structural test noise; transition delay test; yield loss; Built-in self-test; Circuit noise; Circuit testing; Delay; Energy consumption; Noise reduction; Power supplies; System testing; Voltage; Working environment noise;
fLanguage
English
Publisher
ieee
Conference_Titel
Asian Test Symposium, 2008. ATS '08. 17th
Conference_Location
Sapporo
ISSN
1081-7735
Print_ISBN
978-0-7695-3396-4
Type
conf
DOI
10.1109/ATS.2008.85
Filename
4711600
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