A single-chip digital signal processing system

Author

Brewer, Joe E. ; Miller, L. Gray ; Gilbert, Ira H. ; Melia, Joseph F. ; Garde, Doug

Author_Institution

Westinghouse Electr. Corp., USA

fYear

1994

fDate

19-21 Jan 1994

Firstpage

265

Lastpage

272

Abstract

A single-chip 26 million transistor digital processing subsystem is in the final stages of development. This general purpose device can be used as a stand-alone processor or as a building block for both SIMD and MIMD processor arrays. This 120 MFLOPS peak 1.75 watt chip, with 512 k-bytes of on-chip SRAM and sophisticated communications capabilities, requires no glue chips to form processors arrays. This paper describes the physical and functional features of the integrated circuit, and outlines its application potential

Keywords

CMOS integrated circuits; VLSI; digital signal processing chips; multiprocessing systems; 1.75 W; 120 MFLOPS; 26 million transistor; 512 kbyte; CMOS; MIMD processor arrays; SIMD processor arrays; ULSI; chip layout; communications capabilities; functional features; general purpose device; on-chip SRAM; single-chip digital signal processing system; Application specific integrated circuits; Digital signal processing; Digital signal processing chips; Digital signal processors; Integrated circuit technology; Laboratories; Production; Throughput; Transistors; Ultra large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Wafer Scale Integration, 1994. Proceedings., Sixth Annual IEEE International Conference on

Conference_Location

San Francisco, CA

Print_ISBN

0-7803-1850-1

Type

conf

DOI

10.1109/ICWSI.1994.291232

Filename

291232