Design of a large area magnetic field sensor array

Author

Audet, Yves ; Chapman, Glenn H.

Author_Institution

Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada

fYear

1994

fDate

19-21 Jan 1994

Firstpage

273

Lastpage

281

Abstract

The circuit design of a Large Area Magnetic Field Sensor Array (LAMFSA) using CMOS 3 μm process is described. This prototype is developed mainly for application in magnetic field mapping and tactile array sensors. In order to enable the production of such a device, redundancy schemes are implemented and a laser interconnection post fabrication technique is used. The basic sensing cell consists of a double drain/double source MOS magnetic field sensor (MAGFET). The design architecture is strongly influenced by the sensor function and the defect avoidance criteria. Aided by SPICE, test and reconfiguration issues involved in the post fabrication processing are described

Keywords

CMOS integrated circuits; electric sensing devices; integrated circuit testing; magnetic field measurement; redundancy; 3 micron; CMOS process; MAGFET; MOS magnetic field sensor; SPICE; defect avoidance criteria; double drain/double source MOS device; large area magnetic field sensor array; laser interconnection post fabrication technique; magnetic field mapping; reconfiguration; redundancy schemes; tactile array sensors; test; CMOS process; Circuit synthesis; Integrated circuit interconnections; Magnetic sensors; Optical device fabrication; Production; Prototypes; Sensor arrays; Sensor phenomena and characterization; Tactile sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Wafer Scale Integration, 1994. Proceedings., Sixth Annual IEEE International Conference on

Conference_Location

San Francisco, CA

Print_ISBN

0-7803-1850-1

Type

conf

DOI

10.1109/ICWSI.1994.291245

Filename

291245