• DocumentCode
    1859517
  • Title

    Enhanced light absorption in thin-film silicon solar cells by scattering from embedded dielectric nanoparticles

  • Author

    Nagel, James R. ; Scarpulla, Michael A.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Utah, Salt Lake City, UT, USA
  • fYear
    2011
  • fDate
    19-24 June 2011
  • Abstract
    We investigate the light-trapping effects of dielectric nanoparticles embedded within the active semiconductor layer of a thin-film solar cell. The baseline model consists of a 1.0 μm slab of crystalline silicon on an aluminum back contact topped with a 75 nm Si3N4 anti-reflective coating. Using finite-difference time-domain (FDTD) simulations, we calculate the absorption gain due to a periodic array of SiO2 nanospheres with characteristic depth, diameter, and pitch. Under optimal conditions, spectrally integrated absorption gain due to embedded spheres can reach as high as 23.4 % relative to the baseline geometry. Using a geometry with an Au-core and SiO2 shell, it is even possible to reach 30% after accounting for Ohmic losses. We also discuss the trade-offs between broadband scattering efficiency, poor absorption at long-wavelengths, and semiconductor displacement due to the embedded nanospheres.
  • Keywords
    aluminium; elemental semiconductors; finite difference time-domain analysis; nanoparticles; protective coatings; semiconductor thin films; silicon; silicon compounds; solar cells; Al; FDTD simulations; Si; Si3N4; SiO2; active semiconductor layer; aluminum back contact; antireflective coating; broadband scattering; crystalline silicon; embedded dielectric nanoparticles; finite-difference time-domain; light absorption; light-trapping effects; nanospheres; ohmic losses; periodic array; slab; thin-film silicon solar cells; Absorption; Arrays; Dielectrics; Nanoparticles; Photovoltaic cells; Scattering; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference (PVSC), 2011 37th IEEE
  • Conference_Location
    Seattle, WA
  • ISSN
    0160-8371
  • Print_ISBN
    978-1-4244-9966-3
  • Type

    conf

  • DOI
    10.1109/PVSC.2011.6186100
  • Filename
    6186100