• DocumentCode
    1859630
  • Title

    Implementation of a novel zero-insertion-force (ZIF) mems-connector

  • Author

    Jang, Ben-Hwa ; Huang, Hsin-Yu ; Fang, Weileun

  • fYear
    2009
  • fDate
    21-25 June 2009
  • Firstpage
    1710
  • Lastpage
    1713
  • Abstract
    This paper demonstrated on the design, fabrication, and testing of a novel zero-insertion-force (ZIF) MEMS-connector. The three-mask and silicon-on-insulator (SOI) wafer were designed for the easy fabrication of the terminals and latches simultaneously. The terminal was a multi-morph cantilever to form a hook-like shape providing the reliable contact at the contact interface. The terminals and the latches were actuated by electrostatic force to avoid wearing and kinking during the mating process. The implementation details were provided and the property measurement results were conducted to confirm the feasibility and superiority of the proposed ZIF MEMS-connector.
  • Keywords
    electric connectors; flip-flops; microfabrication; micromechanical devices; silicon-on-insulator; wafer level packaging; ZIF MEMS-connector; contact interface; electrostatic force; hook-like shape; latches; mating process; multi-morph cantilever; silicon-on-insulator wafer; three-mask wafer; zero-insertion-force MEMS-connector; Chemical industry; Connectors; Contacts; Fabrication; Micromechanical devices; Plugs; Residual stresses; Shape control; Testing; Transistors; Microelectromechanical systems (MEMS) connectors; Zero insertion force; out-of-plane shape control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International
  • Conference_Location
    Denver, CO
  • Print_ISBN
    978-1-4244-4190-7
  • Electronic_ISBN
    978-1-4244-4193-8
  • Type

    conf

  • DOI
    10.1109/SENSOR.2009.5285731
  • Filename
    5285731