DocumentCode
1860238
Title
Thermal coupling in ICs: Applications to the test and characterization of analogue and RF circuits
Author
Altet, Josep ; Mateo, Diego ; Aldrete-Vidrio, Eduardo
Author_Institution
Electron. Eng. Dept., Univ. Politec. de Catalunya, Barcelona, Spain
fYear
2010
fDate
5-7 July 2010
Firstpage
135
Lastpage
135
Abstract
In this presentation we cover how to use low frequency or DC temperature measurements to observe figures of merit of high frequency analogue circuits.
Keywords
analogue integrated circuits; frequency measurement; integrated circuit testing; radiofrequency integrated circuits; temperature measurement; DC temperature measurement; RF circuit; figures of merit; high frequency analogue circuit; integrated circuit testing; low frequency measurement; thermal coupling; Couplings; Electric variables measurement; Frequency conversion; Frequency measurement; Integrated circuits; Temperature measurement; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
On-Line Testing Symposium (IOLTS), 2010 IEEE 16th International
Conference_Location
Corfu
Print_ISBN
978-1-4244-7724-1
Type
conf
DOI
10.1109/IOLTS.2010.5560220
Filename
5560220
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