Parameter optimization method for fabricating 3D microstructures embedded in single-layer negative-tone photoresist

Author

Hirai, Y. ; Sugano, K. ; Tsuchiya, T. ; Tabata, O.

Author_Institution

Dept. of Micro Eng., Kyoto Univ., Kyoto, Japan

fYear

2009

fDate

21-25 June 2009

Firstpage

1616

Lastpage

1619

Abstract

This paper reports on an optimization method for parameter sets for fabricating 3-dimensional microstructures in a single thick-film photoresist by the moving-mask UV lithography technique. The proposed optimization method employs the UV exposure calculation and the chemical behavior of chemically amplified negative-photoresist considering a cross-linking process during a thermal treatment of post-exposure bake to predict an optimum parameter range. In this paper, the validity of the proposed optimization method was successfully verified by evaluating a microchannel with ldquocmrdquo length covered by a top-membrane and its dependence on the process parameter sets.

Keywords

masks; microchannel flow; optimisation; photoresists; ultraviolet lithography; 3D microstructures; UV lithography; cross linking; microchannel; moving mask; negative-tone photoresist; parameter optimization; single thick-film photoresist; single-layer photoresist; thermal treatment; Chemical processes; Diffraction; Fabrication; Lithography; Microchannel; Microfluidics; Microstructure; Optimization methods; Resists; Shape control; 3-dimensional microstructuring; embedded microchannel; thick-film photoresist;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Sensors, Actuators and Microsystems Conference, 2009. TRANSDUCERS 2009. International

Conference_Location

Denver, CO

Print_ISBN

978-1-4244-4190-7

Electronic_ISBN

978-1-4244-4193-8

Type

conf

DOI

10.1109/SENSOR.2009.5285769

Filename

5285769