• DocumentCode
    1862718
  • Title

    Low cost packaging techniques for commercial GaAs IC components

  • Author

    Steel, V.

  • Author_Institution
    RF Micro Devices Inc., Greensboro, NC, USA
  • fYear
    1996
  • fDate
    3-6 Nov. 1996
  • Firstpage
    18
  • Lastpage
    20
  • Abstract
    Commercial packaging of GaAs IC components such as Power Amplifiers requires special care to ensure proper thermal management while maintaining low cost. Several types of packages are investigated for electrical and thermal performance. Some examples of ICs which utilize various types of plastic packages are also discussed.
  • Keywords
    III-V semiconductors; cooling; gallium arsenide; integrated circuit packaging; plastic packaging; power amplifiers; GaAs; IC components; low cost packaging techniques; plastic packages; power amplifiers; thermal management; thermal performance; Costs; Gallium arsenide; Integrated circuit packaging; Plastic packaging; Power amplifiers; Power system reliability; Radio frequency; Radiofrequency amplifiers; Thermal management; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1996. Technical Digest 1996., 18th Annual
  • Conference_Location
    Orlando, FL, USA
  • ISSN
    1064-7775
  • Print_ISBN
    0-7803-3504-X
  • Type

    conf

  • DOI
    10.1109/GAAS.1996.567628
  • Filename
    567628
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1862718